The Litmas Remote Plasma Source (RPS) is a compact design of an inductive coupled Plasma Source for industrial application. As an integrated package it includes the RF power supply, the solid state matching network and the chamber. The highly efficient design of the RPS allows precise process control and stable power delivery over a wide range of plasma conditions even as the plasma load varies.
Like a Swiss army knife the source is a multifunctional remote plasma source and thus useful for many applications. We will give a short overview about the application.
So in general this Source is a reactive gas generator. It generates a high flux of reactive species. The concept is to keep the charged species out of the chamber and deliver only charged neutral reactants to the substrate and therefore enabling new processes.
In wafer pre-clean applications the Source utilises a confined plasma to generate reactive gases that gently remove hydrocarbons, water vapour, native oxides and other undesirable substances from the substrate surface.
With the dry strip processes, etch species produced in the source chemically react with photoresist on the substrate (wafer) to produce volatile etch products.
In thin film deposition applications such as PEALD, PECVD and PEPVD the RPS helps you precisely and rapidly deposit ultra thin, low defect and high-k dielectric films at the substrate. This will optimise your film properties.
But the Source could be also used as a Perfluorinated compounds (PFCs) and Hydrofluorinated compounds (HFCs) abatement solution in a dielectric etch tool to reduce the global warming footprint in semiconductor processing.
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