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A surface engineering method based on electrostatic deposition of microparticles and anisotropic plasma etching is described and shown to be able to independently tune both amplitude and spatial roughness parameters of the final surface. Statistical models were developed to connect process variables to the amplitude roughness parameters center line average, root mean square and the spatial parameter, autocorrelation length of the final surfaces. Process variables include particle coverage, which affects both amplitude and spatial roughness parameters, particle size, which affects only spatial parameters and etch depth, which affects only amplitude parameters. The experimental results agreed with the model predictions fairly well for amplitude parameters while some discrepancies were observed in the case of autocorrelation length due to the effects of clustering which are not fully captured in our model. |